For the fine-pitch LED display, COB technology has been a consistent focus of industry discussion, particularly since products below P1.0 began to appear and traditional SMD packaging technology started to show its limits. As LED chips get smaller and packing density increases, making the technology work reliably in practice has become a central concern for manufacturers and project […]
Wire-Bond COB vs. Flip-Chip COB: Key Differences in Packaging Technology and Applications