Description
COB TECHNOLOGY
Waterproof, Dustproof, and Anti Impact
Due to the small spacing of conventional SMD small spacing display screen, the display unit cannot be filled with glue, nor can the mask be installed, and the LED is exposed on the outside, which can not really achieve waterproof, dustproof and anti-collision, and even it is easy to touch the lamp beads during handling.
COB integrated packaging technology completely overcomes the difficulties that can not be overcome by small SMD spacing, and truly realizes waterproof, dustproof and anti-collision.
THE DIFFERENCE BETWEEN OF COB AND SMD
After COB packaging, the traditional “surface pasting” process is no longer required. Due to the omission of high-temperature and high-precision process, the problem of “dead lamp” is minimized.
